Brand Name : Found
Model Number : fd46
Certification : UL E361831 ISO9001 TS16949
Place of Origin : China
MOQ : 1PC
Price : Negotiatable
Payment Terms : T/T
Supply Ability : 100000PC
Delivery Time : 2-8 days
Packaging Details : Vacuum packing
Copper thickness : 1oz
Base material : FR-4
Min. line spacing : 0.003"
Board thickness : 1.6mm
Min. line width : 0.1mm
Min. hole size : 0.1mm
Surface finishing : HASL
Number of layers : 4-Layer
Solder mask : Green
Application : Electronics Device
Solder mask color : Green
Product name : Printed Circuit Board
Silkscreen color : White
Service : OEM one-stop service
Testing service : 100% Electrical Test
Material : FR4/94v0/Aluminum/cem-1 cem-3/
Other service : PCB Design
Pcb test : Flying probe and AOI (Default)/Fixture Test
Model NO.: WBPN2256BO
Processing Technology: Electrolytic Foil
Base Material: Copper
Insulation Materials: Epoxy Resin
Brand: Xzg
Size: 268mm*78.6mm
Min. Hole Size: 0.7mm
Min Line Width and Distance: 7/7mil
Solder Mask: Green
Silkscreen: White
Trademark: XZG
Transport Package: Vaccume Package
Specification: UL/GSG/RoHS
Origin: China
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Product Description:
1 | Layer Count | 1-30Layers | |
2 | HDI Type | 1+N+1, 2+N+2 | |
3 | Material | CEM3, FR-4, Halogen Free, Aluminum-based, Teflon,Rogers, Getek, Nelco, PTFE, Polyimide etc | |
4 | Board thickness | 0.2~5.0mm | |
5 | Board Size | Max | 600*1000mm (24"x40") |
Min | 30x50mm | ||
6 | Copper Thickness | Outer layer | 1oz~6oz |
Inner layer | Hoz~5oz | ||
7 | Min. Line Width/Space | 4/4mil(0.1/0.1mm) | |
8 | Finished Hole size | Mechanical | 0.20~6.30mm |
Laser | 5mil, 6mil | ||
9 | Blind/buried via(Mechanical) | 0.2mm (min) | |
10 | Aspect Ratio | 10:1 | |
11 | Hole Dia.Tolerance | PTH | ±0.075mm(3mil) |
NPTH | ±0.05mm (2mil) | ||
12 | Hole Position Tolerance | ±0.05mm (2mil) | |
13 | Bow & Twist | ≤0.75% | |
14 | Peel strength | 1.4N/mm | |
15 | Thermal stress | 288 degrees centigrade & 20 Sec | |
16 | Test Voltage | 50-300V | |
17 | Soldermask color | Green, Red, B |
PCB Type | Single-side pcb , Double side pcb , Multilayer pcb , Aluminum base PCB HDI board pcb , High Tg pcb and so on |
Base Material | XPC ,CEM-1 , CEM-3 , FR-1 , FR4 ,High TG FR4 ,Aluminium , Lead Free Materials (Rohs compliant ),High Frenquency Material and so on |
Layer No . | 1-18 Layers |
Surface Finish | HASL , HASL Lead Free , Immersion Gold ,Gold Plating , Gold Finger , Immersion Silver , Immersion Tin , OSP ,Peelable soldermask and carbon ink |
Silk Screening | In any color such as green ,white ,nlue ,red , black and so on |
Certificate | ISO9001,ISO14001,ISO-TS, UL,ROHS |
Testing | Electrical Testing , Controlled Impedance Testing , Flying Probe Test , X-Ray Inspection AOI Test |
Environment | Clean room environmen , Dust-free workshop |
Transportation | Fedex ,DHL,UPS and so on |
Files | Gerber ,Protel ,Autocad ,Powerpcb , Orcad ,etc |
PRODUCTION CAPACITY
Items | Parameter | Special | ||
Layers Counts | 2-20 | |||
Board material | FR-4,Aluminum | High Tg FR4 | ||
max Fabrication area | 580×700mm | 500mm×3000mm | ||
Board thickness | 0.1-3.2mm | |||
Camber | Double Side multi -layers | d ≤0.075mm d ≤1% | d≤0.05mm | |
Impedance | ±7% | ±5% | ||
PTH tolerance | d>5.0 | ±0.076mm | ||
0.3<d≤5.0 | ±0.05mm | |||
d≤0.3 | ±0.08mm | |||
Min finished hole size | 0.15mm | |||
Hole copper thickness | ≥20um | |||
Min track width, spacing | 0.05mm ×0.05mm | |||
Profile size | ±0.1mm | ±0.05mm | ||
Profile | Routing,Punch,Cut,V-cut,Chanfer | |||
Surface finish | Immersion Gold:0.025~0.075um | |||
Gold finger:≥0.13 um | ≥1.0 um | |||
OSP:0.2-0.5µm | ||||
HAL:5~20 um | ||||
LEADFREE HAL:5~20 um | ||||
Surface plating | Solder mask: Black Green White Red Thickness≥17 um,Block,BGA | |||
Character : Black Yellow Green White style: Highness≥0.0.625mm Width≥0.125mm | ||||
Ppeelable mask: red bule thickness≥300 um | ||||
Carbonink : Black thickness≥25 um Highness≥0.30mm Width≥0.3mm |
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